BEST Inc. provides laser depaneling services for printed circuit board manufacturers and also EMS and OEMs. BEST’s numerous lasers are equipped to manage volumes from small prototype to large production runs. Laser depaneling can cut through plastics, ceramics and metals or some combination thereof. It is the right strategy to use when you will find sharp corners or many tight radii of curvature from the PCB Routing or perhaps in the flex circuit.
Based on the material as well as the part requirements, BEST laser services gives a tool-less part removal process as final perforation, scoring and hold-in tabs. Employing a laser to carry out the depaneling allows the user the main advantage of speed and positional accuracy. Unlike mechanical methods there is no part induced stresses, no tooling cost with no cutting oils or other contaminants.
rigid flex depanelizedIn addition BEST could be that provider of laser depanelization once you have a lot of IoT devices which have to be precisely machined or reduce to match perfectly directly into small mechanical enclosures.
Due to contact-free processing that continues on with Laser Depaneling of printed circuit boards, there is very little distortion even if thin materials are being used. When boards are milled or punched out by using a mechanical tool there may turn out to be a loss precision and potentially a distortion in the outside board dimensions. Even worse it may well crack solder joints when working with these mechanical means. In BEST laser depanelization system feature fiducial registration and online scaling, meaning already existing distortions could be compensated and the cut contours positioned precisely within the layout.
Just like scoring or v-grooves, laser perforations are an alternative for singulated board removal from a panel or sheet. Perforations may be laser formed to any size and spacing to satisfy the specified removal and securement forces.
Laser scoring can certainly produce a limited depth ablation line from the panelized boards. Generally the depth of the score lines are 50% from the material thickness and will be controlled to some desired depth. The scoring acts in the manner like the hold-tab to secure the part inside the panel or sheet, but provides for individual 19dexjpky to become ‘snapped’ out after processing. Laser scoring lines could also be used being a deliberate path for crack propagation or stress relief. When performing the score lines being a service BEST may either use the IPC guidelines or follow customer requirements.
Hold-in tabs are small uncut sections round the board which are employed to secure the PCB Punching inside the panel. The hold-in tabs can be used as easy handling small boards or even for printed circuit board securement for further processing. The hold-in tab width is chosen in accordance with the volume of force desired to get rid of the part in the panel/sheet or known forces to be applied by downstream processes like component loading. BEST laser services can create tabs in many board materials and to nearly any width and location regarding the part.